Liquid Cooling Solutions for AI Data Centers

Amphenol’s OSFP-RHS Cold Plate and Cage 224G and Liquid Cooling Leakage Detection Sensor Cable — efficient thermal management for high-density AI, cloud and HPC infrastructure, with leak protection built in.

Why Liquid Cooling for AI Infrastructure

Air Cooling at Its Limit

GPUs, CPUs and optical modules keep rising in power and density, pushing traditional heat sink and fan cooling past what it can dissipate.

Direct-to-Chip Efficiency

Circulating coolant through cold plates and heat exchangers moves heat away from components far more efficiently in high-density environments.

Leak Detection Built In

Introducing liquid into electronic environments makes early leak detection a priority — small leaks cause shorts, corrosion and downtime.

Designed to Scale

Belly-to-belly compatible cold plate and cage configurations in standard RU and OU rack heights integrate without custom mechanical work.

Thermal Management Is Now a Reliability Problem

Featured Products

OSFP-RHS Cold Plate and Cage 224G

OSFP-RHS Cold Plate and Cage 224G

Liquid Cooling Solution for High-Speed Optical Modules

A single-component cold plate and cage assembly for 224G OSFP optical modules. The 1×N and 2×N RHS cage carries integrated top and bottom row cold plates with a belly-to-belly compatible screw-down mechanism, managing heat across up to 16 ports connected in series on a ganged stacked cage — and installing in a single press step.

  • Cooling: greater than 40 W per module
  • Liquid pressure: 75 PSI maximum active, burst pressure above 230 PSI
  • Assembly: one-step cage and cold plate press assembly
  • Fluid routing: single inlet/outlet, minimising system routing complexity and connections
  • Thermal contact: independent spring-loaded module contact per port
  • Configurations: 1×N and 2×N (N = 4, 8), through-bezel cage mounting
  • Compliance: OSFP MSA, EIA-364-1000, RoHS, REACH and halogen-free
Liquid Cooling Leakage Detection Sensor Cable

Liquid Cooling Leakage Detection Sensor Cable

Early Coolant Leak Detection for Liquid-Cooled Systems

A low-cost, dependable sensor cable assembly that detects coolant leaks in systems using liquid cold plates. The conductive coolant bridges the electrodes in the cable, changing resistance and triggering an alert so the system can be shut down or contained before damage occurs.

  • Detection: passive, real-time resistance-change detection with no moving parts
  • Installation: at pipeline connections or the lowest point of the system chassis
  • Cable OD: less than 3 mm for routing in narrow spaces
  • Reusable: can be dried and returned to service
  • Part numbers: 10183153-001LF (Type A), 10180993-001LF (Type B)
  • Customisation: lengths and terminations tailored to the chassis layout

Cold Plate Configurations


Feature

OSFP 1×8 Liquid Cooling Solution

OSFP 2×8 Liquid Cooling Solution

Part number

V62-ABZ01-XXXXXXX

V62-BBZ08-XXXXXXX

Cage layout

Single row, N = 4 or 8 ports

Stacked belly-to-belly, N = 4 or 8 per row

Cold plate arrangement

Integrated cold plate across the row

Integrated top and bottom row cold plates, up to 16 ports in series

Cooling per module

Greater than 40 W

Greater than 40 W

Assembly

One-step press assembly

One-step press assembly, belly-to-belly screw-down

Best suited to

Single-row faceplate layouts

Stacked, high-density faceplate layouts

How the Leak Detection Cable Works

Applications


AI Training & Inference

AI Training & Inference

Cooling high-power GPU and accelerator racks where thermal density has outgrown air cooling, with leak protection across the coolant loop.

High-Speed Optical Networking

Liquid-cooled 224G OSFP module cages for switches and line cards where optical module power continues to climb.

Cloud & HPC Data Centers

Direct-to-chip cold plate loops serving dense compute and storage platforms running continuous 24/7 workloads.

Liquid-Cooled Chassis Integration

Leak detection at cold plate manifolds, quick disconnects and pipeline joints, plus rugged interconnects for immersion-cooled systems.

Frequently Asked Questions


As GPUs, CPUs and optical modules increase in power and density, traditional air cooling using heat sinks and fans reaches its limits. Liquid cooling circulates coolant through cold plates and heat exchangers, improving thermal management efficiency and energy usage in high-density environments.

The assembly provides cooling for greater than 40 W per module. Maximum active liquid pressure is 75 PSI, with a burst pressure above 230 PSI, and the operating and storage temperature range is -40 °C to +85 °C.

Both are available with N = 4 or 8 ports and install with the same one-step press assembly. The 1×N cage is a single row, while the 2×N cage stacks two rows belly-to-belly with integrated top and bottom row cold plates, managing heat across up to 16 ports connected in series on a ganged stacked cage.

No. The design ensures fluid pressure does not impact insertion or extraction force, so modules insert and extract without added mechanical stress. Each port also has an independent spring-loaded module contact, which maintains consistent thermal performance in hot-pluggable applications.

The assembly is compliant with the OSFP MSA and EIA-364-1000, and is RoHS, REACH and halogen-free compliant. Cage mounting is through bezel, with spring finger EMI options.

The cable uses the conductive properties of the cooling liquid. When coolant bridges the electrodes inside the cable, the electrical resistance changes and the monitoring system raises an alert, allowing shutdown or containment before damage occurs. Only a small volume of liquid is needed to trigger detection.

At pipeline junctions, where fittings and seals are most vulnerable, or at the chassis base, where leaked fluid accumulates due to gravity. This flexibility allows comprehensive coverage so leakage is identified at the earliest possible stage.

Yes. The assembly can be dried and returned to service, which keeps the cost of ownership low compared with single-use detection methods. It is also available as a customised assembly to suit different chassis layouts.

Yes. Amphenol engineers support integrating a liquid cooling system into an existing application, as well as creating custom connector and cable solutions. Contact us with your configuration, length and termination requirements.

Ready to Transform Data Center Thermal Efficiency?

Talk to our engineering team about tailored cooling and connectivity solutions, samples or full datasheets.

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