Thermal Management for AI Data Centers

Industry-leading cooling solutions designed for maximum performance and efficiency in next-generation computing infrastructure.

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High-Performance Air Cooling for High-Impedance AI Architectures

Air cooling remains foundational in AI server design. Even as liquid cooling adoption increases, high static pressure airflow is essential for removing heat from power stages, memory, VRMs, and auxiliary components throughout the chassis.

As heatsink fin density increases and airflow paths narrow, system impedance rises. In these environments, both airflow (CFM) and static pressure must be considered relative to the system’s pressure curve to ensure effective heat transfer under load.

QuadRep supplies high-performance DC cooling fans. SANYO DENKI fans are engineered for high reliability, tight performance tolerances and continuous 24/7 operation in data center environments.

SANYO DENKI DC Cooling Fans

9GA DC Cooling Fan

  • Low power consumption (36% lower than standard models)
  • High cooling performance up to 1084 CFM with static pressure of 1350 Pa

9HV DC Cooling Fan

  • Optimal for high density servers and communication equipment
  • Excellent cooling performance with static pressure up to 2300 Pa

Counter Rotating Fan

  • Generates less turbulent airflow
  • Excellent cooling performance with static pressure up to 2700 Pa

Liquid Cooling Infrastructure for AI Data Centers

High-density AI servers are rapidly adopting liquid cooling to manage extreme thermal loads. Reliable systems depend not only on robust interconnects, but also precise monitoring of pressure and flow throughout the cooling loop.

Amphenol Industrial quick-disconnect liquid cooling connectors deliver leak-free performance, dry-break sealing, and minimal pressure drop for serviceable rack-level cooling systems. Complementing these interconnects, Honeywell pressure sensors provide accurate monitoring of coolant pressure and flow conditions; helping engineers detect restrictions, verify system performance, and protect critical AI hardware.

Together, these solutions enable scalable, maintainable liquid-cooling architectures for next-generation AI infrastructure.

Liquid Cooling Systems

Universal Quick Disconnect

  • Open Compute Project (OCP) approved
  • Available in sizes 02, 04, 06, 08, in both inline and right-angle orientations, with barb or threaded terminations
  • Seal materials include EPDM, FKM, and FMVQ

MIP Series Pressure Sensor

  • Heavy duty, media-isolated pressure transducer
  • Small size to reduce design and manufacturing costs
  • Total Error Band (TEB) as low as 0.75%
  • Hermetically welded design that supports almost all media

Blind Mate Quick Disconnect

  • Tailored for the OCP Open Rack V3 specification
  • High reliability – 100% helium-leak tested
  • Seal materials include EPDM, FKM, and FMVQ

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