Optical and High-Speed I/O Solutions
Amphenol’s complete optical portfolio for AI-scale data centers — XPO-LPO, 1.6T OSFP transceivers, active optical cables and high-speed I/O interconnects, from a single vertically integrated supplier.
Featured Optical Transceivers

XPO-LPO Optical Transceiver
12.8 Tb/s Linear Pluggable Optics for AI Scale-Up
XPO-LPO addresses the power and density wall that conventional OSFP form factors cannot cross. Sixty-four high-speed lanes at 224 Gb/s each deliver 12.8 Tb/s from a single module over a standard MPO optical interface, with liquid cooling designed in for hyperscale AI clusters.

1.6T OSFP Transceivers
200G Per Lane for 800G and 1.6T Ethernet
200G/lane optical modules supporting DR4, FR4, 2×DR4, 2×FR4, AOC and breakout AOC configurations with LC or MPO ports. The 1.6T LPO series covers 500 m over single-mode fiber and is compatible with OSFP IHS connectors and cages.

800Gb/s OSFP Transceivers
Low-Power 800G for AI/ML, Datacom and InfiniBand
800G OSFP modules in 2×DR4(plus), 2×FR4(plus), 2×LR4, AOC and AOC breakout series, with LC or MPO optical ports. CWDM DFB lasers paired with silicon photonics modulator chips keep cost, latency and power down, with almost no additional tuning required.
Choosing a Transceiver Platform
|
Feature |
800Gb/s OSFP |
1.6T OSFP |
XPO-LPO |
|---|---|---|---|
|
Aggregate bandwidth |
800 Gb/s |
800 Gb/s – 1.6 Tb/s |
12.8 Tb/s |
|
Per-lane rate |
106.25 Gb/s |
212.5 Gb/s |
224 Gb/s |
|
Lanes per module |
8 |
8 |
64 |
|
Typical power |
7.5 W (under 8.5 W max) |
Module dependent |
80 W for 12.8 Tb/s |
|
Optical interface |
LC or MPO |
LC or MPO |
MPO |
|
Cooling |
Air |
Air, liquid-cooled cage options |
Liquid cooling by design |
|
Best suited to |
800G Ethernet, InfiniBand and HPC build-outs today |
800G/1.6T scale-out with a 200G/lane switch generation |
The largest AI scale-up deployments |
Active Optical Cables and High-Speed I/O

100G QSFP28 Active Optical Cable
Cost Efficient Plug-and-Play Interconnect
QSFP28 to QSFP28 active optical cable assemblies: a reliable, cost and power efficient integrated solution for the high density signal transmission found in storage, data center and high performance computing applications.

200G QSFP-DD Active Optical Cable
Double Density, Backwards Compatible
QSFP-DD to QSFP-DD assemblies take the lane count from four to eight and double port density against 100G QSFP28 AOCs, while staying backwards port compatible with existing QSFP modules.

QSFP-DD Cable Assemblies
200G / 400G / 800G Passive and Active Copper
Copper cable assemblies that double the channel count from four to eight lanes against existing QSFP cabling, delivering more bandwidth inside the same mechanical envelope. Available in passive and active variants.

Beyond Pluggables: On-Board and Co-Packaged Optics
Not every link belongs on the faceplate. The LEAP® On-Board Transceiver is a rugged 12-channel duplex module running up to 25 Gb/s per channel — 300 Gb/s cumulative — in roughly one square inch of board space at 5.4 W. That is about 2.5× less board area than a 12-channel QSFP28 arrangement, and the optical cable can be routed above or around other components in the design.
Further in, Amphenol’s co-packaged optics extend ownership all the way to the chip: the high-density electrical interposer, the linear optical conversion inside the module, and the fiber plant beyond. Where other suppliers offer a module, this is an architecture — pluggable, modular, and qualified across the whole signal path by one supplier.
Applications

AI Training & Inference Clusters
Scale-up and scale-out fabrics where per-lane rate, latency and watts per bit decide how far a cluster can grow.

Hyperscale Switching & Routing
Front panel density built on ExtremePort™ OSFP connector and cage systems, with 60 contacts per port on a 0.6 mm pitch.

HPC, Server & Storage
InfiniBand, Fibre Channel and SAS links between compute, storage and switching, in copper and active optical variants.

Telecom, 5G Front Haul & Edge
Transceivers from 1G to 400G spanning Fibre Channel storage, inter data center and 5G front haul deployments.
Engineering and Manufacturing Capabilities
Amphenol is US headquartered with full manufacturing capability in China and Taiwan, and experienced global R&D and engineering teams in the US, Germany and China. Optical packaging design and manufacturing, including TOSA and ROSA, is done in-house and tested in mainland China and Taiwan.
Manufacturing runs across 5,000 square metres of clean room space in Shenzhen, Taiwan and Berlin, with capacity for 8,000,000 modules. A low cost manufacturing footprint and flexible supply chain keep the cost model competitive, and a large quality team runs the fully transparent quality systems these markets demand.
Amphenol also plays an active role in MSA committees and works closely with the standards bodies — OIF, IEEE 802.3, the Advanced Photonics Coalition, LPO MSA, PCI-SIG, FCIA, IBTA, SNIA, STA and INCITS T10/T11 — that shape the next generation of optical systems.
Frequently Asked Questions
Ready to Scale Your Optical Infrastructure?
Talk to our engineering team about transceiver selection, samples, custom assemblies or full datasheets.